Products

  • Burn-In Sockets
    • 1 - Burn-in Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • eMMC Package
        • Pitch from 1.27mm upwards
          • Through-hole (THT) soldering Burn-in Socket
            • Burn-in Socket Open Top for 1.27 mm pitch (from 1.27 mm to upwards)

  Back

Burn-in Socket THT Open Top for eMMC Package 1.27 mm pitch (from 1.27 mm to upwards)


  

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. U contact supports any pad or solder ball shape and composition.

E tec

 

 

Part Number

MPS-xxx-12-xx.x-xx

 

Keywords : Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. U contact supports any pad or solder ball shape and composition.

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

Documents (download)

ISO
RoHS
REACH