Products


Burn-in Socket THT Open Top for LGA Package 0.50 mm pitch (from 0.50 mm to 0.79 mm)


  

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.

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Part Number

MPS-xxx-05-xx.x/xx

 

Keywords : Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.