Products


Burn-in Socket THT Open Top for LGA Package 1.27 mm pitch (from 1.27 mm to upwards)


  

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.

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E tec

 

 

Part Number

MPS-xxx-12-xx.x/xx

 

Keywords : Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.