Products


  Back

Burn-in Socket THT Open Top for QFN Package 1.27 mm pitch (from 1.27 mm to upwards)


  

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. U contact supports any pad or solder ball shape and composition.

E tec

 

 

Part Number

QOT-xxx-12-xx.x-xx

 

Keywords : Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. U contact supports any pad or solder ball shape and composition.

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

Documents (download)

ISO
RoHS
REACH