|Hi-rel PLP Series PLCC Socket SMT JEDEC Standards|
E-tec „hi-rel SMT PLCC sockets correspond to JEDEC Norms. Precision stamped contact design provides special „push-down effectonto the leads of the chip. For very high shock and vibration applications a chip retention clip can be obtained on request. Inside polarisation corner prevents wrong insertion of the chips. Stand-off under the base prevents solder shorts. Chips can be easily removed with the Universal extraction tool PUL-200.
|Standard PLS Series PLCC Socket Low profile SMT JEDEC Standards|
Standard PLS Series PLCC Socket SMT JEDEC Standards, only 4.60mm height above board. Identical PCB layout for socket and chip. Solder terminals visible for post solder checks. Available with index pins under the insulator for correct orientation of the sockets. Diagonal slots for easy extraction of the chip with the Universal extraction tool PUL-200. Also available in reel packaging.