Products

Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)


  

The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.

E tec

 

 

Part Number

BEM####-03E#-######55L#

 

Keywords : BEM####-03E#-######55L#,Injection Molded Clamshell Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

Documents (download)

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