Products

  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 0.30mm to 0.39mm
        • Probe Pin Solderless Compression Test Socket
          • Open Clamshell Alu (< 200 contacts)
            • Open Clamshell Alu (< 200 contacts) 0.30 mm pitch (from 0.30 mm to 0.39 mm)

  Back

Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)


  

Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.

E tec

 

 

Part Number

BUH####-0398-######55L#

 

 

Related documents

 

Keywords : BUH####-0398-######55L#,Open Clamshell Alu (< 200 contacts) Probe Pin Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.30 mm pitch (from 0.30 mm to 0.39 mm)

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

Documents (download)

ISO
RoHS
REACH