Products


Probe Pin Solderless Compression Test Socket
For BGA / Bumped chip / WLCSP / eMMC Package
0.30 mm pitch (from 0.30 mm to 0.39 mm)
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E-tec Interconnect AG is the world leading Test socket manufacturer

Probe Pin (Pogo) Solderless compression Test Sockets type are available for any chip size and pitch and are attached with 2, 4 or8 screws to the PCB. The assembly board ensures perfect coplanarity of the socket. Contact reliability is guaranteed with spring loaded gold plated contacts, which are pressed onto gold plated PCB pads. Probe Pin (Pogo) Solderless compression type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket.

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Standard assembly boards

Small Chip size


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MediumChip size


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LargeChip size


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Custom assembly boards

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How to order :

BU # # # # # -0398 - # # # # # # 55L #
e tec

 

 

Related documents

Keywords : BUW####-0398-######55L#, BUW, 0398,