Products

  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 0.40mm to 0.49mm
        • Elastomer Solderless Compression Test Socket
          • QuickLock
            • QuickLock (> 200 contacts) 0.40 mm pitch (from 0.40 mm to 0.49 mm)

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QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)


  

The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.

E tec

 

 

Part Number

BED####-04E#-######55L#

 

 

Related documents

 

Keywords : BED####-04E#-######55L#,QuickLock (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.40 mm pitch (from 0.40 mm to 0.49 mm)

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

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