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To Picture Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 0.80mm to 0.99mm
        • Elastomer Solderless Compression Test Socket
          • Open Lever Clamshell Alu (> 200 contacts)
            • Open Lever Clamshell Alu (> 200 contacts) 0.80 mm pitch (from 0.80 mm to 0.99 mm)

To Browsing Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 0.80mm to 0.99mm
        • Elastomer Solderless Compression Test Socket
          • Open Lever Clamshell Alu (> 200 contacts)
            • Open Lever Clamshell Alu (> 200 contacts) 0.80 mm pitch (from 0.80 mm to 0.99 mm)

Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)


  

The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.

E tec

 

 

Part Number

BEL####-08E#-######55L#

 

 

Related documents

 

Keywords : BEL####-08E#-######55L#,Open Lever Clamshell Alu (> 200 contacts) Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)