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ReverseLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

e tec
E tec

 

 

Part Number

BUR####-087#-#######5#

 

 

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Keywords : BUR####-087#-#######5#, ReverseLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)