Products

  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 0.80mm to 0.99mm
        • Through-hole (THT) soldering Test Socket
          • ScrewLock
            • ScrewLock 0.80 mm pitch (from 0.80 mm to 0.99 mm)

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ScrewLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

E tec

 

 

Part Number

BUS####-087#-#######5#

 

 

Related documents

 

Keywords : BUS####-087#-#######5#,ScrewLock Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

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