Products

To Picture Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.00mm to 1.26mm
        • Raised SMT soldering Test Socket
          • QuickLock
            • QuickLock (> 200 contacts) 1.00 mm pitch (from 1.00 mm to 1.26 mm)

To Browsing Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.00mm to 1.26mm
        • Raised SMT soldering Test Socket
          • QuickLock
            • QuickLock (> 200 contacts) 1.00 mm pitch (from 1.00 mm to 1.26 mm)

QuickLock (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)


  

The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.

E tec

 

 

Part Number

BUD####-102#-######95A#

 

 

Related documents

 

Keywords : BUD####-102#-######95A#,QuickLock (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)