Products


Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

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E tec

 

 

Part Number

BUJ####-107#-#######5#

 

 

Related documents

 

Keywords : BUJ####-107#-#######5#, Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)