Through-hole (THT) soldering Test Socket
For BGA / Bumped chip / WLCSP / eMMC Package
1.00 mm pitch (from 1.00 mm up to 1.26 mm)
For BGA / Bumped chip / WLCSP / eMMC Package
1.00 mm pitch (from 1.00 mm up to 1.26 mm)
E-tec Interconnect AG is the world leading Test socket manufacturer
The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.
How to order :
BU#####-107#-#######5#
Related documents
Keywords : BUM####-107#-#######5#, Injection Molded Clamshell Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)
