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To Picture Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.27mm to upwards
        • Elastomer Solderless Compression Test Socket
          • SpringLock
            • SpringLock 1.27 mm pitch (from 1.27 mm upwards)

To Browsing Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.27mm to upwards
        • Elastomer Solderless Compression Test Socket
          • SpringLock
            • SpringLock 1.27 mm pitch (from 1.27 mm upwards)

SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)


  

The Elastomer Solderless compression Test Sockets are ideal technical solution for good signal integrity with low signal loss. The sockets are available for any chip size and pitch and are attached with 2, 4 or 8 screws to the PCB. The socket outline will be kept to a minimum and special clearances can be offered to avoid components on the PCB.

E tec

 

 

Part Number

BEB####-12E#-######55L#

 

 

Related documents

 

Keywords : BEB####-12E#-######55L#,SpringLock Elastomer Solderless Compression Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)