Products

  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.27mm to upwards
        • Raised SMT soldering Test Socket
          • Open Lever Clamshell Alu (> 200 contacts)
            • Open Lever Clamshell Alu (> 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)

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Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)


  

The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.

E tec

 

 

Part Number

BUL####-1229-######95A#

 

 

Related documents

 

Keywords : BUL####-1229-######95A#,Open Lever Clamshell Alu (> 200 contacts) Raised SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

Documents (download)

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