Products

To Picture Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.27mm to upwards
        • Standard SMT soldering Test Socket
          • SpringLock
            • SpringLock 1.27 mm pitch (from 1.27 mm upwards)

To Browsing Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.27mm to upwards
        • Standard SMT soldering Test Socket
          • SpringLock
            • SpringLock 1.27 mm pitch (from 1.27 mm upwards)

SpringLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)


  

The SMT socket uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.

E tec

 

 

Part Number

BUB####-1230-######95#

 

 

Related documents

 

Keywords : BUB####-1230-######95#,SpringLock Standard SMT soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)