Products

To Picture Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.27mm to upwards
        • Through-hole (THT) soldering Test Socket
          • Clamshell Alu (> 200 contacts)
            • Clamshell Alu (> 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)

To Browsing Search :
  • Test Sockets and Adapters
    • Test Sockets for BGA - Bumped chip - WLCSP - eMMC Package
      • Pitch from 1.27mm to upwards
        • Through-hole (THT) soldering Test Socket
          • Clamshell Alu (> 200 contacts)
            • Clamshell Alu (> 200 contacts) 1.27 mm pitch (from 1.27 mm upwards)

Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

E tec

 

 

Part Number

BUJ####-127#-#######5#

 

 

Related documents

 

Keywords : BUJ####-127#-#######5#,Clamshell Alu (> 200 contacts) Through-hole (THT) soldering Test Socket for BGA - Bumped chip - WLCSP - eMMC Package 1.27 mm pitch (from 1.27 mm upwards)