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Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

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Part Number

LPM####-087#-#######5#

 

 

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Keywords : LPM####-087#-#######5#, Injection Molded Clamshell Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 0.80 mm pitch (from 0.80 mm to 0.99 mm)