Products

  • Test Sockets and Adapters
    • Test Sockets for LGA - QFN - MLF - MLP - LCC Package
      • Pitch from 1.00mm to 1.26mm
        • Through-hole (THT) soldering Test Socket
          • SlimLock
            • SlimLock 1.00 mm pitch (from 1.00 mm to 1.26 mm)

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SlimLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

E tec

 

 

Part Number

LPT####-107#-#######5#

 

 

Related documents

 

Keywords : LPT####-107#-#######5#,SlimLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.00 mm pitch (from 1.00 mm to 1.26 mm)

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

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