Products

  • Test Sockets and Adapters
    • Test Sockets for LGA - QFN - MLF - MLP - LCC Package
      • Pitch from 1.27mm to upwards
        • Raised SMT soldering Test Socket
          • ReverseLock
            • ReverseLock 1.27 mm pitch (from 1.27 mm upwards)

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ReverseLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)


  

The Raised SMT socket lifts the socket above close-by components on PCB and uses the same footprint as your chip. Socket is simply placed and reflowed onto the PCB in the same way as the chip and it only requires a small amount of additional board space. SMT type sockets are available with all retention systems. We aim to solve your requirements. Please note, we will always request the chip data to ensure we offer a compatible socket. For SMT sockets in general, E-tec Interconnect AG recommends the use of locating pegs, which can be soldered to the PCB for added mechanical strength.

E tec

 

 

Part Number

LPR####-1229-######95A#

 

 

Related documents

 

Keywords : LPR####-1229-######95A#,ReverseLock Raised SMT soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

Documents (download)

ISO
RoHS
REACH