Products

  • Test Sockets and Adapters
    • Test Sockets for LGA - QFN - MLF - MLP - LCC Package
      • Pitch from 1.27mm to upwards
        • Through-hole (THT) soldering Test Socket
          • SpringLock
            • SpringLock 1.27 mm pitch (from 1.27 mm upwards)

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SpringLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)


  

The Through-hole socket uses the same footprint as your chip. Socket is simply placed and wave soldered onto the PCB in the same way as the chip and it only requires a small amount of additional board space. Through-hole sockets are available with all retention systems. Please note, we will always request the chip data to ensure we offer a compatible socket.

E tec

 

 

Part Number

LPB####-127#-#######5#

 

 

Related documents

 

Keywords : LPB####-127#-#######5#,SpringLock Through-hole (THT) soldering Test Socket for LGA - QFN - MLF - MLP - LCC Package 1.27 mm pitch (from 1.27 mm upwards)