Products

  • Test Sockets and Adapters
    • THT - SMT Adapters
      • BGA Package Solder Adapter
        • Pitch from 0.80mm to upwards
          • Through-hole (THT) soldering adapter
            • BGA Package Solder Adapter ABG and MGS THT

  Back

BGA Package Solder Adapter ABG and MGS THT


  

The E-tec Interconnect BGA Package Solder Adapter ABG and MGS system was develop for low cost test of BGA packages or to use it in embedded systems with the flexibility of exchange the package for future updates, replacement or reparations. Thus, this system has only slightly larger external dimensions than the BGA device, and thus takes much less space on your PC board to complete.

This adapter system gives your BGA device legs and make it pluggable. Steps:

- First: Solder the BGA device to our adapter (ABG Series)
- Second: Solder MGS adapter on your PCB. As emulates the package dimension and footprint, is easily installed using standard flux and reflow techniques.
- Third: You can plug the ABG adapter (with your already soldered BGA Package) into our MGS adapter and start using it.

We offer any pin-out, configuration and grid size for pitch 0.8mm, 1.00mm and 1.27mm. Other pitch and special terminals designs are possible on request

E tec

 

 

Part Number

ABG####-####-####5## + MGS####-E###-####5##

 

 

Related documents

 

Keywords : ABG####-####-####5## + MGS####-E###-####5##,BGA Package Solder Adapter ABG and MGS THT

E-tec Interconnect
Address

E-tec Interconnect AG
Friedhofstrasse 1
CH-2543 Lengnau
Switzerland

Contacts

Email : info [ at ]  e-tec.com
Phone :  +41 32 654 15 50 
Fax :  +41 32 652 26 93 
Contact : Pablo Rodriguez

Documents (download)

ISO
RoHS
REACH