Burn-In Sockets > 1 - Burn-in Sockets for BGA - Bumped chip - WLCSP - eMMC Package > BGA Package > Pitch from 0.50mm to 0.79mm > Solderless Compression Burn-in Socket > 
E-tec

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Solderless Compression Burn-in Socket
Burn-in Socket Open Top for 0.50 mm pitch (from 0.50 mm to 0.79 mm)
 E-Tec
BPT-xxx-05-xx.x/xx

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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