Burn-In Sockets > 1 - Burn-in Sockets for BGA - Bumped chip - WLCSP - eMMC Package > BGA Package > Pitch from 1.27mm upwards > Through-hole (THT) soldering Burn-in Socket > 
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Through-hole (THT) soldering Burn-in Socket
Burn-in Socket Open Top for 1.27 mm pitch (from 1.27 mm to upwards)
 E-Tec
MPS-xxx-12-xx.x/xx

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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