Burn-In Sockets > 2 - Burn-in Sockets for LGA - QFN - MLF - MLP - LCC Package > QFN Package > Pitch from 1.00mm to 1.26mm > Through-hole (THT) soldering Burn-in Socket > 
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Through-hole (THT) soldering Burn-in Socket
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Burn-in Socket Clamshell for 1.00 mm pitch (from 1.00 mm to 1.26 mm) |
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QMC-xxx-10-xx.x/xx Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages. |
Burn-in Socket Open Top for 1.00 mm pitch (from 1.00 mm to 1.26 mm) |
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QOT-xxx-10-xx.x/xx Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.00mm up to 1.26mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition. |
