Burn-In Sockets > 2 - Burn-in Sockets for LGA - QFN - MLF - MLP - LCC Package > QFN Package > Pitch from 1.27mm upwards > Through-hole (THT) soldering Burn-in Socket > 
PLEASE SELECT :
Through-hole (THT) soldering Burn-in Socket
Burn-in Socket Clamshell for 1.27 mm pitch (from 1.27 mm to upwards) |
|
|
QMC-xxx-12-xx.x/xx Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages. |
Burn-in Socket Open Top for 1.27 mm pitch (from 1.27 mm to upwards) |
|
|
QOT-xxx-12-xx.x/xx Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 1.27mm pitch to upwards. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition. |