Burn-In Sockets > 3 - Burn-in Sockets for SOP - DSO - SOIC - QFP - xQFP Package > SOP Package > Pitch from 0.50mm to 0.79mm > Through-hole (THT) soldering Burn-in Socket > 
E-tec

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Through-hole (THT) soldering Burn-in Socket
Burn-in Socket Open Top for 0.50 mm pitch (from 0.50 mm to 0.79 mm)
 E-Tec
OTZ-xxx-05-xx.x/xx.x/xx.x

Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.50mm up to 0.79mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. "U" contact supports any pad or solder ball shape and composition.
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