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Burn-in Socket THT Clamshell for QFN Package 1.27 mm pitch (from 1.27 mm to upwards)


Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.

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Keywords : Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. U contact supports any pad or solder ball shape and composition.