Burn-in Socket with ClamShell Style for Thru-Hole mount. Individual spring-loaded pressure pad per device type. Inexpensive GP insert accommodates many package sizes. Opening provided on top for sensor placement. X-shape stand-off prevents package from sticking. Accommodate 0.5~1.2mm thick packages.
Burn-in Socket Open Top Style. Accommodates Chip Scale Package with 0.40 up to 0.49mm pitch. Compact size and low actuation force. 4-point pinch design for enhanced electrical contact. Field exchangeable package location plate. U contact supports any pad or solder ball shape and composition.